Seminar 1 Due Diligence Practices to Avoid Counterfeit Components L. Pappas, L. Hamiter, T. Lee, D. Trenholm, E. Jordan, B. Cardoso, R. Hammond, M. Marshall Counterfeit electronic components have become so prolific that all OEMs and Independent Distributors should be taking counterfeits due diligence practices to detect and avoid shipping customers counterfeits that flood the secondary market. This seminar will explain various methods for identifying when components are counterfeit or highly suspect. In addition to various techniques used to obscure that the components remarked or reclaimed they are now harvesting die from old used parts and repackaging with markings that look original and authentic. There have been a number of prosecutions of distributors for shipping counterfeits. To reduce the risk of legal liability it is important to perform “due diligence” in detecting them. This seminar explains the different techniques to use in providing the components are not counterfeit. The following topics will be covered: - Legal issues - Visual inspection criteria - Industry & military marking standards - X-ray & demonstration - De-capping techniques & equipment - XRF inspection of leads - Die inspection approaches - Manufacturing of counterfeits - Electrical testing techniques - Detecting counterfeit passives - Implementing “due diligence” Seminar 1 Notes and a certificate of attendance will be provided Monday 8:30am - 5:00pm Parallel Seminar 2 Components Engineering & Reliability Capacitors, J. Prymak, Kemet Electrtonics Film Resistors, R. Pinkleman, Vishay/Dale Integrated Circuits - Technologies and Failure Mechanisms, R. Lowry Consultant Metal Foil Resistors & ESD Issues, Y. Hernik, Vishay PG Magnetics Technology, TBD Electronic systems reliability is highly dependent on the selecting the most suitable electronic components and the reliability they provide over the design lifetime. This seminar provides valuable information on selecting the correct components plus degradation and failure mechanisms which should be considered in their circuit application. The seminar is composed of the following topics: - Capacitor technology & performance; John Prymak, Kemet This will cover ceramic tantalum, aluminium and film capacitor characteristics and selection for correct applications. The constrictions approaches and materials used are explained for each type. The recent advancements in technologies and impact of performance, volumetric efficiency in relationship to semiconductor developments are highlighted. - Film resistor & fuse types & performance characteristics; Randy Pinkelman, Vishay Dale Various types and technology used in the manufacturing of thick film, thin film and wirewound resistors will emphasis on performance, application and packaging will be discussed. The applicable military specs for resistors will be emphasised relative to the applications & environments they are most suited for. Film types of fuses will be covered. - Metal foil resistor applications & demo of ESD capability; Yuval Hernik, Vishay PG - Integrated circuit technology, packages & failure mechanisms; Robert Lowery, Consultant This session will cover the various technology of categories of ICs and packaging. The failure mechanisms for the connon packages and die materials/technology will be explained. This includes issues with use of PEMs in military and space electronics. - Magnetic device technologies; TBD Each attendant will receive a copy of notes.