5.2 Advancements in Military Wet Slug Tantalum Capacitors;
B. Brunette, AVX Tantalum
5.3 High Voltage Tantalum Polymer Capacitors;
Y. Freeman, KEMET Electronics
5.4 Long Term Dormant Storage Experiment of COTS
Components Under Field Conditions;
L. Rohwer, R. Wavrik, J. Aragon, J. White, J. Marchiondo,
Sandia National Labs
5.5 Systems Approach to Failure Analysis;
Chet O’Brien, BAE Systems Inc.
5.6 Delamination Gap Detection Capability of SAM;
R. Hudson, Sandia National Labs
Parallel Sessions for 5 and 6
2:00 - 5:00pm
Session 6: Space Applications & Rad Hard
Chair: David Strobel, Space Micro
6.1 Quantified Commercial Off-the-Shelf NV-RAM -
A Case Study;
C. Hafer, M. Von Thun, F. Sievert, T. Jordan, B. Bauer,
Aeroflex Colorado Springs
6.2 Space Navigation Star Tracker Development Based on
COTS Parts;
A. Mara, M. Fennell, D. Strobel, K. Rose, D. Czajkowski,
Space Micro Inc.
6.3 Radiation Characterization of Flash-Based FPGAs:
Pro ASIC3;
S. Rezgui, J. Wang, J. McCollum, Actel Corp.
6.4 A Step-by-Step Procedure to Integrate Transformer
Coupled LVDS into your SpaceWire Application;
J. Larsen, F. Sievert, Aeroflex Colorado Springs
6.5 Radiation Hard/Mitigated COTS Electronics for Space;
D. Strobel, D. Bozek, K. Rose, D. Sellers, D. Czajkowski,
Space Micro Inc.
6.6 Radiation Hardening of Fiber Optic Systems for Missile
and Space Applications;
C. Tabbert, Jazz Semiconductor
6.7 A Low Power Cell Balancer for Lithium-Ion Batteries;
J. Castaldo, G. Altemose, Aeroflex Plainview
6.8 Miniaturized DACS Module for MDA Interceptors;
D. Strobel, A. Kurlovich, H. Cerna, M. Fennell, D. Czajkowski,
Space Micro Inc.
thursday, february 14
8:00 - 12:00noon
Session 7: FPGA and Complex ICs
Chair: Anthony Lai, Aitech
Overview: Performance Computing Trends in Relation to
Component Selection
A. Lai, Aitech
7.1 Testing and Reliability Issues with FPGAs;
R. Roosta, D. Sheldon, Jet Propulsion Lab
7.2 Secure, High-Performance, Parallel Embedded
Architectures Using Acalis® CPU872 PowerPC®
Multicore;
J. Swensen, G. Walters, CPU Technology Inc.
7.3 The Case of Applying Formal Verification to Designs with
FPGAs and ASICs;
R. Roger, B. Hughes, Actel Corporation
7.4 FPGA to ASIC Conversion for Radiation Hardened
Applications;
B. Coco, Aeroflex Colorado Springs
7.5 Using FPGA Devices as Application Specific Standard
Products (ASSP);
S. Habinc, J. Gaisler, Aeroflex Gaisler AB
1:00 - 3:30pm
Session 8: DC/DC Converters
Chair: Edward Erginsoy, Aitech
8.1 Radiation Assurance of a Space Qualified Point-of-Load
Converter;
P. Berthet, 3D Plus-USA
8.2 Thick Film Hybird DC-DC Converters and Standard
for Satellite Power Systems;
T. Bussarakons, International Rectifier
8.3 Advance Packaging Techniques for Hybrid Modules;
J. Lee, C. McKleroy, D. Apte, Microwave Technology Inc.
8.4 The “New Hybrid”;
F. Muscolino, Austin Semiconductor Inc.
Close of CMSE 2009
3:30 - 4:30pm
Study Group: Screening & Characterization Process
Chair: Jerome Trupiano, BAE Systems
All attendees are invited.
For latest CMSE Program changes see:
www.cti-us.com
