CMSE Technical Sessions 12:00 - 2:00pm Lunch with the Exhibitors 2:00 - 5:00pm Parallel with Session 7 Session 6: Rad Hard Components & Technology Chair: Ron Lake, Aeroflex 6.1 INVITED SPEAKER: Rad Hard Issues with Advanced Technologies; J. Benedetto, Aeroflex 6.2 Soft Errors in Modern Memory Technology; C. Slayman, M. Silverman; Ops A La Carte 6.3 Memory Roadmap for HiRel Applications; A. Jordan, Aeroflex Colorado Springs 6.4 TID, SEL and SEE Radiation Tests Methodology and Results for a Highly Integrated and Space Qualified Point of Load Converter; P-E Berthet, 3D Plus 6.5 A Methodology for Incorporation of Displacement Damage Effects into the Qualification of MIL-PRF-19500 Radiation Hardness Assurance (RHA) Devices; B. Triggs, SEMICOA 6.6 Reconfigurable Advanced COTS- based Electronics & Detectors for New Space Missions; D. Czajkowski, M. Fennell, D. Sellers, B. Vermeire, D. Strobel, E. Li, J. Romero, Space Micro Inc. 2:00 - 5:00pm Parallel with Session 6 Session 7: Return of Seal Leak and RGA Issues Organizer & Chairman: Robert Lowry, Consultant 7.1 Introduction to Hermeticity and RGA Issues; B. Lowry, Electronic Materials Consulting 7.2 Gross Leak Immersion Test Challenges in Hermetically Sealed Microelectronic Assemblies; C. Slayman, M. A. DerMarderosian Jr., Raytheon 7.3 Impact of a Tighter Leak Spec and Issue with Correlation; T. Green, TJ Green Associates LLC 7.4 Theory and Results of Kr85 Leak Testing; G. Neff, Isovac Engineering 7.5 Modern Gettering Technologies for Hermetic Microelectronics and MEMs Packaging; R. Kullberg, Vacuum Energy, Inc. 7.6 High Vacuum MEMs Packaging Challenges; D. Muhs, P. Barnes, SST International 7.7 DSCC Perspective on Moisture Control and Hermiticity; A. Barone, D. Miller, DSCC 7.8 Discussion & Summary Close of General Sessions Thursday, February 10 8:00 - 11:00 noon Parallel Tutorial & Workshop Tutorial - Advance X-Ray Techniques and Equipment; Dr. B. Cardoso, Creative Electron This tutorial covers the latest x-ray technology in the detection and identification of counterfeit electronic components. It is targeted at component engineers, quality personnel and provides hands on training on the state of the art equipment that will allow attendees to dramatically improve their quality assurance programs.The equipment and software will be used to demonstrate its value in detecting counterfeit components. In addition its other operating techniques will be demonstrated which include: - 2D X-ray Inspection - 3D X-ray Inspection - Component Tomography (CT) Scan - X-ray Microscopic Inspection Workshop - Hermeticity Testing for Military Components; Thomas J. Green, TJ Green Associates LLC Hermiticity testing and associated high moisture inside packages intended for Military and space applications continue to be of critical importance. The course covers brief description of hermetic sealing process, current leak test techniques in Mil- Std-883 Test Method 1014, plus the traditional helium methods, gross leak testing, Optical Leak Test (OLT), Radioisotope Kr-85 and Cumulative Helium Leak Detection. The focus will be on practical issues facing the user and important lessons learned over the years. Also discussed is the package RGA limit of Residual Gas Analysis related to 5,000 PPM as to expected lifetimes of fielded systems.A comprehensive set of course notes and the “Practical Guide to TM 1014” will be provided each attendee. Close of CMSE 2011 4 Information 256-536-1304 Leon.Hamiter34@cti-us.com www.cti-us.com